BRR : 7109796
Tender Brief : Supply Of Supply Of Bonding Wire Ig-8 Swg (4.064 Mm Dia) For Track Circuit Bonding As Per Spn No. Is-279/81.Supply Of Bonding Wire Ig-8 Swg (4.064 Mm Dia) For Track Circuit Bonding As Per Spn No. Is-279/81.,Supply Of Bonding Wire Ig-8 Swg (4.064 Mm Dia) For Track Circuit Bonding As Per Spn No. Is-279/ 81. [ Warranty Period: 30 Months After The Date Of Delivery ] Read More
Tender Value
₹
Ref. Document
Contract Value
₹ 38,350
Submission Date
09-07-2024
Contract Date
13-07-2024
Completion Date
Ref. Document
Participated Bidder List
1 No of Bidder(s)
| Sr No. | Bidder Name | Bid Analytics | Technical Bid | Financial Bid | AOC | Bid Value | Rank |
|---|---|---|---|---|---|---|---|
| 1 | cnet-technologies | Bid Analytics | 38,350 | L1 |
Work Detail
supply of supply of bonding wire ig-8 swg (4.064 mm dia) for track circuit bonding as per spn no. is-279/81.supply of bonding wire ig-8 swg (4.064 mm dia) for track circuit bonding as per spn no. is-279/81.,supply of bonding wire ig-8 swg (4.064 mm dia) for track circuit bonding as per spn no. is-279/ 81. [ warranty period: 30 months after the date of delivery ]
View Original Notice/Document
Result Documents
Tender Documents
| Download | File Name | File Description |
|---|---|---|
| Download | e33f04f8-05d9-4ac2-b378-0f550f6eb25f |
Disclaimer
We takes all possible care for accurate & authentic tender information. However users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender
✦ ✦ ✦
Awarded Bidder(s)
1
cnet-technologies
Rank : L1 (Lowest)
Bid Amount :
₹
1,00,00,000
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