BRR : 8368400
Tender Brief : Supply Of Supply Of Bonding Wire Ig-8 Swg (4.064 Mm Dia) For Track Circuit Bonding As Per Spn No. Is-279/81.Supply Of Bonding Wire Ig-8 Swg (4.064 Mm Dia) For Track Circuit Bonding As Per Spn No. Is-279/81.,Galvanised Flexible Wire Rope (Fmc) 6 X 19 Construction 6Mm Dia, Is : 2266 [ Warranty Per Iod: 30 Months After The Date Of Delivery ] ] Read More
Tender Value
₹
Ref. Document
Contract Value
₹ 18,613.32
Submission Date
17-11-2025
Contract Date
03-12-2025
Completion Date
Ref. Document
Participated Bidder List
1 No of Bidder(s)
| Sr No. | Bidder Name | Bid Analytics | Technical Bid | Financial Bid | AOC | Bid Value | Rank |
|---|---|---|---|---|---|---|---|
| 1 | cnet-technologies | Bid Analytics | 18,613.32 | L1 |
Work Detail
supply of supply of bonding wire ig-8 swg (4.064 mm dia) for track circuit bonding as per spn no. is-279/81.supply of bonding wire ig-8 swg (4.064 mm dia) for track circuit bonding as per spn no. is-279/81.,galvanised flexible wire rope (fmc) 6 x 19 construction 6mm dia, is : 2266 [ warranty per iod: 30 months after the date of delivery ] ]
View Original Notice/Document
Result Documents
Tender Documents
| Download | File Name | File Description |
|---|---|---|
| Download | 7372dcac-726a-44ef-963a-6357002b9ae4 |
Disclaimer
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✦ ✦ ✦
Awarded Bidder(s)
1
cnet-technologies
Rank : L1 (Lowest)
Bid Amount :
₹
1,00,00,000
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