BRR : 4822830
Tender Brief : Bids Are Invited For Ac Odu Support Structure, Lead Copper Shield Cavity, Hd Camera Shielding Enclosure (Q3) Mse Total Quantity : 1 Read More
Tender Value
₹
Ref. Document
Contract Value
₹ 4,30,700
Submission Date
16-03-2024
Contract Date
Ref. Document
Completion Date
Ref. Document
Participated Bidder List
2 No of Bidder(s)
| Sr No. | Bidder Name | Bid Analytics | Technical Bid | Financial Bid | AOC | Bid Value | Rank |
|---|---|---|---|---|---|---|---|
| 1 | cnet-technologies | Bid Analytics | |||||
| 2 | cnet-technologies | Bid Analytics | 4,30,700 | L1 |
Work Detail
bids are invited for ac odu support structure, lead copper shield cavity, hd camera shielding enclosure (q3) mse total quantity : 1
View Original Notice/Document
Result Documents
Tender Documents
| Download | File Name | File Description |
|---|---|---|
| Download | 7b1b8af4-0a83-4b7b-b634-d4ee295dff3d |
| Download | File Name | File Description |
|---|---|---|
| Download | 01c15344-52f9-486f-93a8-f544a8087578 | Tender Documents |
Disclaimer
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Awarded Bidder(s)
1
cnet-technologies
Rank : L1 (Lowest)
Bid Amount :
₹
1,00,00,000
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