}

Tender For Bin Modules & Accessories With Modules Assembled In Bin As Per Ga-19-009755-A3-Multi State

Electronics Corporation Of India Limited has published Tender For Bin Modules & Accessories With Modules Assembled In Bin As Per Ga-19-009755-A3. Submission Date for this Tender is 16-09-2025. Transformer Supply Tenders in Multi State. Bidders can get complete Tender details and download the document.




Tender Notice

51132480
Tender For Bin Modules & Accessories With Modules Assembled In Bin As Per Ga-19-009755-A3
Tender
Indian
Multi State
16-09-2025

Tender Details

Tender For Bin Modules & Accessories With Modules Assembled In Bin As Per Ga-19-009755-A3 BIN MODULES AND ACCESSORIES WITH MODULES ASSEMBLED ICA MODULE SC MODULE TRIP MODULE HVPS MODULE LVPS MODULE TRANSFORMER MOUNTING PLATE PCB MOUNTING BRACKET HEAT SINK AS PER MD-19-009779-A4. RAW MATERIAL TESTING CHARGES .

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Tender Value
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