}

Bids Are invited for Title1 - Thermal Sensor , Title2 - 3D Lidar , Title3 - Depth Cameras , Title4 - Mixed Reality Device , Title5 - Ar Device (Android) , Title6 - 360 Degree Camera With Tripod Stand , Title7 - Xr Device 256 Gb With Link Cable , Titl, Bhopal-Madhya Pradesh

National Institute Of Technology has published Bids Are invited for Title1 - Thermal Sensor , Title2 - 3D Lidar , Title3 - Depth Cameras , Title4 - Mixed Reality Device , Title5 - Ar Device (Android) , Title6 - 360 Degree Camera With Tripod Stand , Title7 - Xr Device 256 Gb With Link Cable , Titl. Submission Date for this Tender is 30-09-2025. Biometric Machine Tenders in Bhopal Madhya Pradesh. Bidders can get complete Tender details and download the document.




Tender Notice

51100900
Bids Are invited for Title1 - Thermal Sensor , Title2 - 3D Lidar , Title3 - Depth Cameras , Title4 - Mixed Reality Device , Title5 - Ar Device (Android) , Title6 - 360 Degree Camera With Tripod Stand , Title7 - Xr Device 256 Gb With Link Cable , Titl
Tender
Indian
Madhya Pradesh
Bhopal
30-09-2025
BootCamp

Tender Details

Bids Are invited for Title1 - Thermal Sensor , Title2 - 3D Lidar , Title3 - Depth Cameras , Title4 - Mixed Reality Device , Title5 - Ar Device (Android) , Title6 - 360 Degree Camera With Tripod Stand , Title7 - Xr Device 256 Gb With Link Cable , Title8 - Audio System 4 In 1 Channel Multimedia Speaker System , Title9 - Advanced Vr Device (512 Gb) With Link Cable & Carry Case , Title10 - Vr Ready Workstation , Title11 - High Resolution Camera Systems (Computer Vision Input) Resolution 8 Mp To 50 + Mp , Title12 - Haptics Device , Title13 - Hyper Spectral Camera , Title14 - Fingerprint Scanner , Title15 - Iris Scanner Total Quantity : 24

Key Value

Document Fees
Refer document
Tender Value
INR 41.40 Lakhs /-

Attachment

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