}
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    • Bids Are Invited For Proc Card G3ins_ Soc_ V3 Processor Board Processor- Card- G3ins_ Soc_ V3, Number Of Layers: 20, Thicknes , G3ins Mother Board, Mother Board Pcb G3ins-Mother- Board Aircrafts_ V8, Number Of Layers: 14, Thickne , Printed Circuit Bo, Sultanpur-Uttar Pradesh

    Hindustan Aeronautics Limited has published Bids Are Invited For Proc Card G3ins_ Soc_ V3 Processor Board Processor- Card- G3ins_ Soc_ V3, Number Of Layers: 20, Thicknes , G3ins Mother Board, Mother Board Pcb G3ins-Mother- Board Aircrafts_ V8, Number Of Layers: 14, Thickne , Printed Circuit Bo. Submission Date for this Tender is 16-09-2025. Printed Circuit Assemblies Tenders in Sultanpur Uttar Pradesh. Bidders can get complete Tender details and download the document.




    Tender Notice

    50871445
    Bids Are Invited For Proc Card G3ins_ Soc_ V3 Processor Board Processor- Card- G3ins_ Soc_ V3, Number Of Layers: 20, Thicknes , G3ins Mother Board, Mother Board Pcb G3ins-Mother- Board Aircrafts_ V8, Number Of Layers: 14, Thickne , Printed Circuit Bo
    Tender
    Indian
    Uttar Pradesh
    Sultanpur
    16-09-2025

    Tender Details

    Bids Are Invited For Proc Card G3ins_ Soc_ V3 Processor Board Processor- Card- G3ins_ Soc_ V3, Number Of Layers: 20, Thicknes , G3ins Mother Board, Mother Board Pcb G3ins-Mother- Board Aircrafts_ V8, Number Of Layers: 14, Thickne , Printed Circuit Board Total Quantity : 26

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