}
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    • Bids Are Invited For Supply Of Bsc Pcb Board R108.30.0200 Assembly Details As Per The Annexure-I , Supply Of Spare Components Bom And Pcbs Kit Of Bsc Pcb R108.30.0200 Details As Per The Annexure-I , Nre Charges For Bsc Pcb R108.30.0200 For Phase -I Pc, Ranga Reddy-Telangana

    Department of Defence Production has published Bids Are Invited For Supply Of Bsc Pcb Board R108.30.0200 Assembly Details As Per The Annexure-I , Supply Of Spare Components Bom And Pcbs Kit Of Bsc Pcb R108.30.0200 Details As Per The Annexure-I , Nre Charges For Bsc Pcb R108.30.0200 For Phase -I Pc. Submission Date for this Tender is 25-11-2024. Printed Circuit Assemblies Tenders in Ranga Reddy Telangana. Bidders can get complete Tender details and download the document.




    Tender Notice

    45983351
    Corrigendum : Bids Are Invited For Supply Of Bsc Pcb Board R108.30.0200 Assembly Details As Per The Annexure-I , Supply Of Spare Components Bom And Pcbs Kit Of Bsc Pcb R108.30.0200 Details As Per The Annexure-I , Nre Charges For Bsc Pcb R108.30.0200 For Phase -I Pc
    Tender
    Indian
    Telangana
    Ranga Reddy
    25-11-2024

    Tender Details

    Bids Are Invited For SUPPLY OF BSC PCB BOARD R108.30.0200 ASSEMBLY DETAILS AS PER THE ANNEXURE-I , SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BSC PCB R108.30.0200 DETAILS AS PER THE ANNEXURE-I , NRE CHARGES FOR BSC PCB R108.30.0200 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS , NRE CHARGES FOR BSC PCB R108.30.0200 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS , SUPPLY OF BFM PCB BOARD R108.30.0300 ASSEMBLY DETAILS AS PER THE ANNEXURE-I , SUPPLY OF SPARE COMPONENTS BOM AND PCBS KIT OF BFM PCB DETAILS AS PER THE ANNEXURE-I , NRE CHARGES FOR BFM PCB R108.30.0300 FOR PHASE -I PCB LAYOUT DESIGN, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS , NRE CHARGES FOR BFM PCB R108.30.0300 FOR PHASE -II PCB LAYOUT DESIGN MODIFICATION, GERBER FILES FOR PCB MANUFACTURING, PCB ASSEMBLY, SI, PI AND THERMAL ANALYSIS Total Quantity : 34

    Corrigendum Details

    Sr No CorrigendumDate Corrigendum CorrigendumType NewSubmissionDate
    1 21-11-2024 25-11-2024

    Key Value

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