}
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    • Bids Are Invited For Fabrication Of Following Pcbs With Solder Mask And Legend On 2.4 Mm (+/-10%) Glass Epoxy Enig Finish With Smd & Pth Components, 180 Microns Copper Thickness, Bbt Testing Required. P/N : Bgf Pe 04 1070B Board Name: Pam Afe Power , Thiruvananthapuram-Kerala

    Department Of Electronics And Information Technology has published Bids Are Invited For Fabrication Of Following Pcbs With Solder Mask And Legend On 2.4 Mm (+/-10%) Glass Epoxy Enig Finish With Smd & Pth Components, 180 Microns Copper Thickness, Bbt Testing Required. P/N : Bgf Pe 04 1070B Board Name: Pam Afe Power . Submission Date for this Tender is 25-03-2024. Printed Circuit Assemblies Tenders in Thiruvananthapuram Kerala. Bidders can get complete Tender details and download the document.




    Tender Notice

    42655407
    Bids Are Invited For Fabrication Of Following Pcbs With Solder Mask And Legend On 2.4 Mm (+/-10%) Glass Epoxy Enig Finish With Smd & Pth Components, 180 Microns Copper Thickness, Bbt Testing Required. P/N : Bgf Pe 04 1070B Board Name: Pam Afe Power
    Open Tender
    Indian
    Kerala
    Thiruvananthapuram
    25-03-2024

    Tender Details

    Bids Are Invited For Fabrication Of Following Pcbs With Solder Mask And Legend On 2.4 Mm ( + / -10% ) Glass Epoxy Enig Finish With Smd & Pth Components, 180 Microns Copper Thickness, Bbt Testing Required. P / N : Bgf Pe 04 1070B Board Name: Pam Afe Power Card No. Of Layers: 4 Board Size: 28 Cmx 10.5 Cm Qty - 03 ( Additional Terms And Conditions Attached ) ( Q3 ) Total Quantity : 6

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