}
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    • Bids Are Invited For 1 Chip Bonder Smt Glue 2 Solder Wire Tin Lead Silver 63/35/2 22Swg Rma 10 Units Of 0.5Kg Total Quantity : 12, Bengaluru Urban-Karnataka

    Department Of Telecommunications has published Bids Are Invited For 1 Chip Bonder Smt Glue 2 Solder Wire Tin Lead Silver 63/35/2 22Swg Rma 10 Units Of 0.5Kg Total Quantity : 12. Submission Date for this Tender is 03-08-2023. Other Adhesives and Sealants Tenders in Bengaluru Urban Karnataka. Bidders can get complete Tender details and download the document.




    Tender Notice

    38720956
    Bids Are Invited For 1 Chip Bonder Smt Glue 2 Solder Wire Tin Lead Silver 63/35/2 22Swg Rma 10 Units Of 0.5Kg Total Quantity : 12
    Tender
    Indian
    Karnataka
    Bengaluru Urban
    03-08-2023

    Tender Details

    Bids Are Invited For 1 Chip Bonder Smt Glue 2 Solder Wire Tin Lead Silver 63 / 35 / 2 22Swg Rma 10 Units Of 0.5Kg Total Quantity : 12

    Key Value

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