

Department of Defence Production has published Bids Are Invited For Multi Layer, 14 Layered Fr4 Pcb, Thickness: 2.4Mm, Size: 160Mm X 100Mm, Input Output Board Pcb, Part (Q3) , Multi Layer, 8 Layered Fr4 Pcb, Thickness: 2.4Mm, Size: 233.5Mm X 100 Mm, Video Switching Board Pcb, (Q3) , Multi Layer, . Submission Date for this Tender is 31-01-2023. Printed Circuit Assemblies Tenders in Hyderabad Telangana. Bidders can get complete Tender details and download the document.
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