}

Bids Are Invited For Multi Layer, 14 Layered Fr4 Pcb, Thickness: 2.4Mm, Size: 160Mm X 100Mm, Input Output Board Pcb, Part (Q3) , Multi Layer, 8 Layered Fr4 Pcb, Thickness: 2.4Mm, Size: 233.5Mm X 100 Mm, Video Switching Board Pcb, (Q3) , Multi Layer, , Hyderabad-Telangana

Department of Defence Production has published Bids Are Invited For Multi Layer, 14 Layered Fr4 Pcb, Thickness: 2.4Mm, Size: 160Mm X 100Mm, Input Output Board Pcb, Part (Q3) , Multi Layer, 8 Layered Fr4 Pcb, Thickness: 2.4Mm, Size: 233.5Mm X 100 Mm, Video Switching Board Pcb, (Q3) , Multi Layer, . Submission Date for this Tender is 31-01-2023. Printed Circuit Assemblies Tenders in Hyderabad Telangana. Bidders can get complete Tender details and download the document.




Tender Notice

35669956
Bids Are Invited For Multi Layer, 14 Layered Fr4 Pcb, Thickness: 2.4Mm, Size: 160Mm X 100Mm, Input Output Board Pcb, Part (Q3) , Multi Layer, 8 Layered Fr4 Pcb, Thickness: 2.4Mm, Size: 233.5Mm X 100 Mm, Video Switching Board Pcb, (Q3) , Multi Layer,
Open Tender
Indian
Telangana
Hyderabad
31-01-2023

Tender Details

Bids Are Invited For Multi Layer, 14 Layered Fr4 Pcb, Thickness: 2.4Mm, Size: 160Mm X 100Mm, Input Output Board Pcb, Part (Q3) , Multi Layer, 8 Layered Fr4 Pcb, Thickness: 2.4Mm, Size: 233.5Mm X 100 Mm, Video Switching Board Pcb, (Q3) , Multi Layer, 20 Layered Fr4 Pcb, Thickness: 3.84Mm, Size: 283Mm X 98 Mm, Backplane Pcb, Part No: M10 (Q3) , Multi Layer, 14 Layered Fr4 Pcb, 3.2 Mm Thick, Size: 97.8 Mm X 163.1 Mm, Circular Connector Board Pc (Q3) Total Quantity : 74

Key Value

Document Fees
Refer document
EMD
Refer document
Tender Value
Refer document
Disclaimer :
We takes all possible care for accurate & authentic tender information, however Users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender.
Tell us about your Product / Services,
We will Find Tenders for you

Copyright © 2025 · All Rights Reserved. Terms of Usage | Privacy Policy

For Tender Information Services Visit : TenderDetail