}

Tender For Design, Development, Fabrication, Assembly, Testing, Pre-Dispatch Inspection & Warranty Of Multilayer Printed Circuit Boards For Fpga Based Gamma Multichannel Logging Probe-Telangana

Department Of Atomic Energy has published Tender For Design, Development, Fabrication, Assembly, Testing, Pre-Dispatch Inspection & Warranty Of Multilayer Printed Circuit Boards For Fpga Based Gamma Multichannel Logging Probe. Submission Date for this Tender is 15-07-2020. Printed Circuit Assemblies Tenders in Telangana. Bidders can get complete Tender details and download the document.




Tender Notice

24613768
Tender For Design, Development, Fabrication, Assembly, Testing, Pre-Dispatch Inspection & Warranty Of Multilayer Printed Circuit Boards For Fpga Based Gamma Multichannel Logging Probe
Open Tender
Indian
Telangana
15-07-2020

Tender Details

Tender For Design, Development, Fabrication, Assembly, Testing, Pre-Dispatch Inspection & Warranty Of Multilayer Printed Circuit Boards For Fpga Based Gamma Multichannel Logging Probe

Key Value

Document Fees
Refer document
EMD
Refer document
Tender Value
Refer document
Disclaimer :
We takes all possible care for accurate & authentic tender information, however Users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender.
Tell us about your Product / Services,
We will Find Tenders for you

Copyright © 2025 · All Rights Reserved. Terms of Usage | Privacy Policy

For Tender Information Services Visit : TenderDetail