bids are invited for alteration in the existing moulding dies to accommodate new design proposed by scl. - alteration in the existing moulding dies to accommodate new design proposed by scl. this new design shall have gasket sealing on the outer periphery of pcb as shown in the attached drawing and detailed scope of work. , ultrasonic welding process development - ultrasonic welding process development, procurement of horns and fixture development for new assembly scheme proposed by scl as per attached drawing , further major alterations - further major alterations (plate replace/insert change/new electrode edm) in moulding die required in future, if any. payment shall be made on actual quantity of the goods/service provided. , further minor alterations - further minor alterations (vmc machining/ facing/grinding/pins change) in moulding die required in future, if any. payment shall be made on actual quantity of the goods/service provided. , development and procurement of sealing gasket - development and procurement of sealing gasket required for component assembly. , supply of ultrasonic welded assembly using pbt 30 percent gf material - supply of ultrasonic welded assembly using pbt 30% gf material as per drawing attached . vendor shall submit the finalized cad model/drawings along with the delivered parts. , supply of ultrasonic welded assembly using pps 30 percent gf material - supply of ultrasonic welded assembly using pps 30% gf material as per drawing attached. vendor shall submit the finalized cad model/drawings along with the delivered parts. , supply of housing of pbt -30 percent gf -material - supply of housing of pbt (30% gf) material , supply of cap of pbt -30 percent gf- material - supply of cap of pbt (30% gf) material , supply of housing of pps -30 percent gf -material - supply of housing of pps (30% gf) material , supply of cap of pps -30 percent gf- material - supply of cap of pps (30% gf) material , assembly using ultrasonic welding of injection mo