BRR : 8838752
Click Here To View Tendering Authority. Technical Bid City/State :  DIC Electronics Niketan CGO Complex Lodhi Road ND, Delhi
Tender Brief : Empanelment Of The Firm/Agency To Provide The Packaging Solution For The Handloom And Handicraft Products Tender For The Empanelment Of The Firm/Agency To Provide The Packaging Solution For The Handloom And Handicraft Products To Be Sold Through E-Commerce Portal Of Ministry Of Textile Implemented By Digital India Corporation Read More
Tender Value
Ref. Document
Submission Date
27-11-2020
Participated Bidder List
2 No of Bidder(s)
Sr No. Bidder Name Bid Analytics Technical Bid Financial Bid AOC Bid Value Rank
1 cnet-technologies Bid Analytics
2 cnet-technologies Bid Analytics
Work Detail
empanelment of the firm/agency to provide the packaging solution for the handloom and handicraft products tender for the empanelment of the firm/agency to provide the packaging solution for the handloom and handicraft products to be sold through e-commerce portal of ministry of textile implemented by digital india corporation
View Original Notice/Document
Result Documents
Tender Documents
Download File Name File Description
Download techsummary_626880 aoc document
Download aac26570-ee94-484b-899b-b95881fe58c1 technicalevaluation notice
Download File Name File Description
Download EF47046D-CBB3-4023-85BD-182639007C99 Tender Documents - Tender Notice
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