BRR : 7690678
Tender Brief : Bids Are Invited For Design And Manufacturing Compound Die For Punching Of Core Lamination Stamping(Pmg) Component Total Quantity : 1 Read More
Tender Value
₹
Ref. Document
Contract Value
₹ 11,03,898.31
Submission Date
09-07-2025
Contract Date
Ref. Document
Completion Date
Ref. Document
Participated Bidder List
5 No of Bidder(s)
| Sr No. | Bidder Name | Bid Analytics | Technical Bid | Financial Bid | AOC | Bid Value | Rank |
|---|---|---|---|---|---|---|---|
| 1 | cnet-technologies | Bid Analytics | |||||
| 2 | cnet-technologies | Bid Analytics | |||||
| 3 | cnet-technologies | Bid Analytics | 11,05,089.83 | L2 | |||
| 4 | cnet-technologies | Bid Analytics | 17,06,000 | L3 | |||
| 5 | cnet-technologies | Bid Analytics | 11,03,898.31 | L1 |
Work Detail
bids are invited for design and manufacturing compound die for punching of core lamination stamping(pmg) component total quantity : 1
View Original Notice/Document
Result Documents
Tender Documents
| Download | File Name | File Description |
|---|---|---|
| Download | 8570e89a-8e9d-4ff1-8db0-6eddbe820057 |
Disclaimer
We takes all possible care for accurate & authentic tender information. However users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender
✦ ✦ ✦
Awarded Bidder(s)
1
cnet-technologies
Rank : L1 (Lowest)
Bid Amount :
₹
1,00,00,000
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