BRR : 6171393
Tender Brief : Bids Are Invited For Silicon Carbide Grinding Wheel ( Resin Bond ) Size: 125 ( Dia ) X 13 ( Thickness ) X 20 Mm ( Bore ) Specn: 39 ( Q3 Total Quantity : 200 Read More
Tender Value
₹
Ref. Document
Contract Value
₹ 71,864.41
Submission Date
03-11-2023
Contract Date
Ref. Document
Completion Date
Ref. Document
Participated Bidder List
3 No of Bidder(s)
| Sr No. | Bidder Name | Bid Analytics | Technical Bid | Financial Bid | AOC | Bid Value | Rank |
|---|---|---|---|---|---|---|---|
| 1 | cnet-technologies | Bid Analytics | |||||
| 2 | cnet-technologies | Bid Analytics | 1,18,644.07 | L2 | |||
| 3 | cnet-technologies | Bid Analytics | 71,864.41 | L1 |
Work Detail
bids are invited for silicon carbide grinding wheel ( resin bond ) size: 125 ( dia ) x 13 ( thickness ) x 20 mm ( bore ) specn: 39 ( q3 total quantity : 200
View Original Notice/Document
Result Documents
Tender Documents
| Download | File Name | File Description |
|---|---|---|
| Download | b9976058-3597-45fa-b3a7-8677ba68f46a |
Disclaimer
We takes all possible care for accurate & authentic tender information. However users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender
✦ ✦ ✦
Awarded Bidder(s)
1
cnet-technologies
Rank : L1 (Lowest)
Bid Amount :
₹
1,00,00,000
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