BRR : 6154427
Tender Brief : Bids Are Invited For Component Assembly On Multi-Layer Printed Circuit Boards (Q3) Mse Total Quantity : 5 Read More
Tender Value
₹
Ref. Document
Contract Value
₹ 4,50,750
Submission Date
20-09-2023
Contract Date
Ref. Document
Completion Date
Ref. Document
Participated Bidder List
5 No of Bidder(s)
| Sr No. | Bidder Name | Bid Analytics | Technical Bid | Financial Bid | AOC | Bid Value | Rank |
|---|---|---|---|---|---|---|---|
| 1 | cnet-technologies | Bid Analytics | |||||
| 2 | cnet-technologies | Bid Analytics | |||||
| 3 | cnet-technologies | Bid Analytics | 6,02,500 | L2 | |||
| 4 | cnet-technologies | Bid Analytics | 4,50,750 | L1 | |||
| 5 | cnet-technologies | Bid Analytics | 11,11,420 | L3 |
Work Detail
bids are invited for component assembly on multi-layer printed circuit boards (q3) mse total quantity : 5
View Original Notice/Document
Result Documents
Tender Documents
| Download | File Name | File Description |
|---|---|---|
| Download | a2f64602-cfc6-4f99-9eee-288bc516a756 |
| Download | File Name | File Description |
|---|---|---|
| Download | d0fbbdb6-718c-4512-bfdc-e4aba96c4bb5 | Tender Documents |
Disclaimer
We takes all possible care for accurate & authentic tender information. However users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender
✦ ✦ ✦
Awarded Bidder(s)
1
cnet-technologies
Rank : L1 (Lowest)
Bid Amount :
₹
1,00,00,000
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