BRR : 4102011
Tender Brief : Bids Are Invited For Electronic Subsystems Dvm (Q3) , Electronic Subsystems Fm (Q3) , Electronic Subsystems Qm (Q3) , Electronic Subsystems Mechanical Package Design Structural And Thermal Analysis Report (Q3) Total Quantity : 6 Read More
Tender Value
₹
Ref. Document
Contract Value
₹ 7,27,46,100
Submission Date
05-04-2024
Contract Date
Ref. Document
Completion Date
Ref. Document
Participated Bidder List
3 No of Bidder(s)
| Sr No. | Bidder Name | Bid Analytics | Technical Bid | Financial Bid | AOC | Bid Value | Rank |
|---|---|---|---|---|---|---|---|
| 1 | cnet-technologies | Bid Analytics | 7,27,46,100 | L1 | |||
| 2 | cnet-technologies | Bid Analytics | 13,69,87,500 | L3 | |||
| 3 | cnet-technologies | Bid Analytics | 9,80,43,648 | L2 |
Work Detail
bids are invited for electronic subsystems dvm (q3) , electronic subsystems fm (q3) , electronic subsystems qm (q3) , electronic subsystems mechanical package design structural and thermal analysis report (q3) total quantity : 6
View Original Notice/Document
Result Documents
Tender Documents
| Download | File Name | File Description |
|---|---|---|
| Download | 77aed46c-707c-4e94-9c57-41750e588dee |
| Download | File Name | File Description |
|---|---|---|
| Download | 2b724091-2502-4bf2-a0ea-b9a564a52814 | Tender Documents |
Disclaimer
We takes all possible care for accurate & authentic tender information. However users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender
✦ ✦ ✦
Awarded Bidder(s)
1
cnet-technologies
Rank : L1 (Lowest)
Bid Amount :
₹
1,00,00,000
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