BRR : 2008774
Tender Brief : Supply Of Pm6 Auto Precision Lapping And Polishing Machine ( Ii ) Triple Station Wafer Substrate Bonding Unit With Pump ( Iii ) Ncg-2 Non-Contact Thickness Measurement Gauge ( Iv ) Aws1 Abrasive Wire Saw With Consumables Read More
Tender Value
₹
Ref. Document
Contract Value
₹ 2,17,663.58
Submission Date
02-03-2020
Contract Date
08-02-2021
Completion Date
140 days
Participated Bidder List
1 No of Bidder(s)
| Sr No. | Bidder Name | Bid Analytics | Technical Bid | Financial Bid | AOC | Bid Value | Rank |
|---|---|---|---|---|---|---|---|
| 1 | cnet-technologies | Bid Analytics | 2,17,663.58 | L1 |
Work Detail
supply of pm6 auto precision lapping and polishing machine ( ii ) triple station wafer substrate bonding unit with pump ( iii ) ncg-2 non-contact thickness measurement gauge ( iv ) aws1 abrasive wire saw with consumables
View Original Notice/Document
Result Documents
Tender Documents
| Download | File Name | File Description |
|---|---|---|
| Download | fad6fed4-b7fc-497f-b744-cc20c12154c8 |
Disclaimer
We takes all possible care for accurate & authentic tender information. However users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender
✦ ✦ ✦
Awarded Bidder(s)
1
cnet-technologies
Rank : L1 (Lowest)
Bid Amount :
₹
1,00,00,000
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