bids are invited for soc application processor (apu): quad-core arm cortex-a53 mpcore, up to 1.5 ghz real-time processor (rpu): dual-core arm cortex-r5f mpcore, up to 600 mhz graphics processor (gpu): mali-400 mp2, up to 667 mhz video codec unit (vcu) dynamic memory interface: x16: ddr4 w/o ecc; x32/x64: ddr4, lpddr4, ddr3, ddr3l, lpddr3 w/ ecc static memory interfaces: nand, 2x quad-spi high-speed connectivity: pcie gen2 x4, 2x usb3.0, sata 3.1, displayport, 4x trimode gigabit ethernet general connectivity: 2x usb 2.0, 2x sd/sdio, 2x uart, 2x can 2.0b, 2x i2c, 2x spi, 4x 32b gpio programmable logic (pl) system logic cells: 504k system logic cells: 504k clb flip-flops: 461k clb luts: 230k max. distributed ram: 6.2 mb total block ram: 11.0 mb ultraram: 27.0 mb clock management tiles (cmts): 8 dsp slices: 1,728 pci express: 1x gen3x16 & 1x gen3x8 (configuration dependent on available transceivers) gth transceivers: 24 (up to 16.3 gb/s; 12.5 gb/s in sfvc784/sfve784 packages) integrated 1 gbps ethernet to axi-stream ip core package of the ic: c1156 — 35mm x 35mm, 1.0mm ball pitch total quantity :