BRR : 11539608
Tender Brief : Laying Of 300Mm Dia Swg Line At Huda Techno Enclave, Patrika Nagar Under Madhapur Section, Sub Division-I, O And M Division-Xv. Read More
Tender Value
₹
8,39,446
Contract Value
₹ 5,11,978.12
Saving / Difference
₹ 3,27,468
▲
Submission Date
04-07-2025
Contract Date
Ref. Document
Completion Date
Ref. Document
Participated Bidder List
1 No of Bidder(s)
| Sr No. | Bidder Name | Bid Analytics | Technical Bid | Financial Bid | AOC | Bid Value | Rank |
|---|---|---|---|---|---|---|---|
| 1 | cnet-technologies | Bid Analytics | 5,11,978.12 | L1 |
Work Detail
laying of 300mm dia swg line at huda techno enclave, patrika nagar under madhapur section, sub division-i, o and m division-xv.
View Original Notice/Document
Result Documents
Tender Documents
| Download | File Name | File Description |
|---|---|---|
| Download | b196f351-1ce8-4169-b6ab-d13c2615fac5 | result notice |
Disclaimer
We takes all possible care for accurate & authentic tender information. However users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender
✦ ✦ ✦
Awarded Bidder(s)
1
cnet-technologies
Rank : L1 (Lowest)
Bid Amount :
₹
1,00,00,000
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