BRR : 11068566
Tender Brief : Filling In Pouring Of Gravel & 6Mm Chips At Renuka Yellamma Temple Premises Of Telephone Colony In Boduppal Municipal Corporation Under General Funds (Recall) Read More
Tender Value
₹
3,97,983
Contract Value
₹ 3,86,441.49
Saving / Difference
₹ 11,542
▲
Submission Date
14-02-2022
Contract Date
Ref. Document
Completion Date
Ref. Document
Participated Bidder List
1 No of Bidder(s)
| Sr No. | Bidder Name | Bid Analytics | Technical Bid | Financial Bid | AOC | Bid Value | Rank |
|---|---|---|---|---|---|---|---|
| 1 | cnet-technologies | Bid Analytics | 3,86,441.49 | L1 |
Work Detail
filling in pouring of gravel & 6mm chips at renuka yellamma temple premises of telephone colony in boduppal municipal corporation under general funds (recall)
View Original Notice/Document
Result Documents
Tender Documents
| Download | File Name | File Description |
|---|---|---|
| Download | fd674374-d10c-491d-a122-0e37bbc7972a | result notice |
Disclaimer
We takes all possible care for accurate & authentic tender information. However users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender
✦ ✦ ✦
Awarded Bidder(s)
1
cnet-technologies
Rank : L1 (Lowest)
Bid Amount :
₹
1,00,00,000
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