tender for supply of equipment for advanced semiconductor lab , price schedule for equipment (sheet 1) , price schedule for services (sheet 2) , automatic dicing saw , wafer mounting system , uv curing station , plasma cleaner , burn in test system , multifunctional bond tester , pcb prototyping and smt technology lab , vacuum pumping system , wafer - n type , wafer - p type , wafer - n type , wafer - p type , ceramic porous chuck , 2 bbd flange , hub blade handling tool , flange handling tool , film frame , hub blade , dressing board , round groove chuck , uv tape , clean room table size 1800x750x750mmh , clean room table size 1200x750x750mmh , clean room table size 1500x1200x750mmh , clean room table size 900x1200x750mmh , clean room table size 900x1350x750mmh , esd cleanroom chairs , esd workbench , esd chairs , esd mat , stand for esd apron, gloves and esd slippers , set of esd accessories , ups 20 kva with 30 min backup , silicon wafer with sio2 layer p type , silicon wafer with sio2 layer n type , training for asu instructor, faculty and asup officials or any others persons as nominated by asup on all items under scope of supply for minimum 15 days after delivery and one more training for 1 week after 3 months at field including consumables required during training period. , calibration of instruments and warranty for 3 years including comprehensive maintenance. attending complaint and correcting any defects. please enable macros to view boq information