Bids Are invited for Dd6a3000303nsns-Heat Sink For Artix-7 Fpga, High Performance Maxiflow With Thermal Tape Attachment , Dd6a3000701nsns-Heatsink For Bga ;Pbga, High Performance, Maxiflow With Thermal Tape, Size 15X15x17.5Mm , Heat Sink For Bga& ;Pb
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Project Description
Bids Are invited for Dd6a3000303nsns-Heat Sink For Artix-7 Fpga, High Performance Maxiflow With Thermal Tape Attachment , Dd6a3000701nsns-Heatsink For Bga ;Pbga, High Performance, Maxiflow With Thermal Tape, Size 15X15x17.5Mm , Heat Sink For Bga& ;Pbga, High Performance Maxiflow With Thermal Tape, Blue Anodized, Size 25X25x12.5 Mm , Dd6a3000501nsns- Heatsink For Bga& ;Pbga, High Performance Maxiflow With Thermal Tape, Size 15X15x12.5Mm
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Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 11 daysBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 12 daysTender Documents
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