Bids Are invited for Procurement Of Items For Design Development Of Integrated Instrumentation Training Platform
Tender Overview
Project Description
Bids Are invited for Modular Aluminum Profile Based Main Training Panel , Multi Sensor Measurement Characterization System , Load And Strain Measurement Module , Temperature Measurement Module , Pressure Measurement Module , Displacement Measurement Module , Angular And Speed Measurement Module , Light,Level And Flow Measurement , Signal Conditioning Module , Analog Signal Processing Module , Bridge And Amplifier Module , Closed Loop Pid Control Module , Industrial Sensor Interface Module , Controller And Io Interface , Hmi Based Monitoring , Computer Based Data Acquisition And Logging , Multi Parameter Integrated Monitoring , Power Supply And Interconnection System , Measurement Accessories And Experimental Modules , System Integration,Testing And Commissioning
BOQ
| Sl. No. | Item Title | Item Description |
| 1 | Modular aluminum profile based main training panel | As per SOW |
| 2 | Multi Sensor Measurement Characterization System | As per SOW |
| 3 | Load and strain measurement module | As per SOW |
| 4 | Temperature measurement module | As per SOW |
| 5 | Pressure measurement module | As per SOW |
| 6 | Displacement measurement module | As per SOW |
| 7 | Angular and speed measurement module | As per SOW |
| 8 | Light,level and flow measurement | As per SOW |
| 9 | Signal conditioning module | As per SOW |
| 10 | Analog signal processing module | As per SOW |
| 11 | Bridge and amplifier module | As per SOW |
| 12 | Closed loop PID control module | As per SOW |
| 13 | Industrial sensor interface module | As per SOW |
| 14 | Controller and IO interface | As per SOW |
| 15 | HMI Based monitoring | As per SOW |
| 16 | Computer Based data acquisition and logging | As per SOW |
| 17 | Multi parameter integrated monitoring | As per SOW |
| 18 | Power supply and interconnection system | As per SOW |
| 19 | Measurement accessories and experimental modules | As per SOW |
| 20 | system integration,testing and commissioning | As per SOW |
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 1 dayBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 2 daysTender Documents
Download All (ZIP) ↓We takes all possible care for accurate & authentic tender information. However users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender