Bids Are invited for Mother Board
Tender Value
Ref. Documents
Estimated cost
Bid Submission
02 Nov 2026
6 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem
Tender Overview
Organization
Tender ID
Competition Type
NCB
Bidding Type
Tender
Location / State
Leh → Ladakh
EMD Exemption
Not Available
Quantity
13
Website
Contact Person
Address
Project Description
Bids Are invited for Heat Sink Past With Teflon Grease , Battery 9 V , Bty 12V 7 Ah , Teflon Sleeve 1020 , Pressure Roller , Logic Card Printer Hp-1020 , Led Monitor 18.5 Inch , Processor I3 14 Th Gen , Mother Board
BOQ
| Sl. No. | Item Title | Item Description |
| 1 | Heat Sink Past with Teflon Grease | Heat Sink Past with Teflon Grease |
| 2 | Battery 9 V | Battery 9 V |
| 3 | Bty 12V 7 AH | Bty 12V 7 AH |
| 4 | Teflon Sleeve 1020 | Teflon Sleeve 1020 |
| 5 | Pressure roller | Pressure roller |
| 6 | Logic Card Printer HP-1020 | Logic Card Printer HP-1020 |
| 7 | Led Monitor 18.5 inch | Led Monitor 18.5 inch |
| 8 | Processor i3 14 th Gen | Processor i3 14 th Gen |
| 9 | Mother Board | Mother Board |
AI Tender Summary
Tender Timeline
Oct 23, 2026
11:30 IST
Tender Published
Tender notice published.
CompletedNov 02, 2026
17:00 IST
Bid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 6 daysNov 03, 2026
Bid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 7 daysTender Documents
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Disclaimer
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