Bids Are invited for Purchase Of Equipment
Tender Overview
Project Description
Bids Are invited for Vr Prototype Development Ar Device Integrated System , Ai Development Kits , 3D Lidar Sensor , Raspberry Pi Robotics Kits , Temperature And Humadity Sensor - Temperature And Humadity Sensor , Vibration Sensor , Mq Series Sensor 1 To 7 , Force Sensor , Pressure Sensor , Network Storage Nas , Server Or Cloud Node , Protype Device Board
BOQ
| Sl. No. | Item Title | Item Description |
| 1 | VR prototype Development AR Device Integrated System | VR prototype Development AR Device Integrated System |
| 2 | AI Development Kits | AI Development Kits |
| 3 | 3D Lidar Sensor | 3D Lidar Sensor |
| 4 | Raspberry Pi Robotics Kits | Raspberry Pi Robotics Kits |
| 5 | Temperature and Humadity Sensor | Temperature and Humadity Sensor |
| 6 | Vibration Sensor | Vibration Sensor |
| 7 | MQ Series Sensor 1 to 7 | MQ Series Sensor 1 to 7 |
| 8 | Force Sensor | Force Sensor |
| 9 | Pressure Sensor | Pressure Sensor |
| 10 | Network Storage NAS | Network Storage NAS |
| 11 | Server or Cloud Node | Server or Cloud Node |
| 12 | Protype Device Board | Protype Device Board |
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 16 daysBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 17 daysTender Documents
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