Bids Are invited for Thermistor Sensor , Heated Bed For Print Adhesion , Filament Sensor , Cooling Fan , Psu - Psu (Power Supply Unit) , Display Screen
Tender Value
Ref. Documents
Estimated cost
Bid Submission
23 Oct 2026
6 days left
EMD
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Bank guarantee accepted
Document Fee
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Non-refundable
Tender Type
Gem
Tender Overview
Organization
Tender ID
Competition Type
NCB
Bidding Type
Tender
Location / State
Jhansi → Uttar Pradesh
EMD Exemption
Not Available
Quantity
6
Website
Contact Person
Address
Project Description
Bids Are invited for Thermistor Sensor , Heated Bed For Print Adhesion , Filament Sensor , Cooling Fan , Psu - Psu (Power Supply Unit) , Display Screen
BOQ
| Sl. No. | Item Title | Item Description |
| 1 | Thermistor Sensor | Thermistor Sensor |
| 2 | Heated Bed For Print Adhesion | Heated Bed For Print Adhesion |
| 3 | Filament Sensor | Filament Sensor |
| 4 | Cooling Fan | Cooling Fan |
| 5 | PSU | PSU (Power Supply Unit) |
| 6 | Display Screen | Display Screen |
AI Tender Summary
Tender Timeline
Oct 13, 2026
11:30 IST
Tender Published
Tender notice published.
CompletedOct 23, 2026
17:00 IST
Bid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 6 daysOct 24, 2026
Bid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 7 daysTender Documents
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