Bids Are invited for Upgradation And Renewal Of Cyber Forensic Toolkits
Tender Overview
Project Description
Bids Are invited for Digital Forensic Toolkit For Analysis Of Various Internet Artifacts , Software Based Tool For The Logical Level Analysis Of Mobile Phones , Software For Forensic Previewing Imaging And Analysis Of Digital Media , Hardware Toolkit For Physical And Logical Level Analysis Of Phone And Sim Card , High End Desktop Workstation
Corrigendum
| Sr No | Corrigendum Date | Corrigendum | Type | New Submission Date |
|---|---|---|---|---|
| 1 | 26-Oct-2026 | 31-Oct-2026 |
BOQ
| Sl. No. | Item Title | Item Description |
| 1 | digital forensic toolkit for analysis of various internet artifacts | digital forensic toolkit for analysis of various internet artifacts |
| 2 | software based tool for the logical level analysis of mobile phones | software based tool for the logical level analysis of mobile phones |
| 3 | software for forensic previewing imaging and analysis of digital media | software for forensic previewing imaging and analysis of digital media |
| 4 | hardware toolkit for physical and logical level analysis of phone and sim card | hardware toolkit for physical and logical level analysis of phone and sim card |
| 5 | high end desktop workstation | high end desktop workstation |
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedCorrigendum-1 Issued
Clarifications on tender conditions and amendments issued.
Upcoming · 3 daysBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 3 daysBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 4 daysTender Documents
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