Defence Government Departments Closing in 12 days TDR #57820024

Tender For Processing Of Epi-Wafer And Fabrication Of 976Nm Laser Chips And Packaging

Issued by Government Departments · Delhi, Delhi
Tender Value
Ref. Documents
Estimated cost
Bid Submission
15 Oct 2026
12 days left
EMD
2.97 Lakhs
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Online

Tender Overview

Organization
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Tender ID
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Competition Type
NCB
Bidding Type
Tender
Location / State
Delhi → Delhi
EMD Exemption
Available
Quantity
Not Available
Website
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Contact Person
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Address
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Project Description

Tender for Processing Of Epi-Wafer And Fabrication Of 976Nm Laser Chips And Packaging

AI Tender Summary

OUR REF NO 57820024
AUTHORITY Government Departments
TENDER VALUE Ref. Documents
LAST DATE 15-10-2026
Authority
Authority Name Department Of Defence Research And Development
Work Description Tender for Processing Of Epi-Wafer And Fabrication Of 976Nm Laser Chips And Packaging
Basic Detail
Tender No SSPL/MMG/DPP/SBM/B/R/26-27/094
Bidding Type Tender
Location
City Delhi
State Delhi
Key Dates
Publish Date 01 Oct 2026
Submission Date 15 Oct 2026
Open Date 16 Oct 2026
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD 2.97 Lakhs
Exemption Available
Document List
a32b890f-c547-4421-a101-13026f73bb9f.html
BOQ_888144.xls
RFP2627094.pdf
Tendernotice_1.pdf
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Tender Timeline

Oct 01, 2026
11:30 IST

Tender Published

Tender notice published.

Completed
Oct 15, 2026
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Upcoming · 12 days
Oct 16, 2026

Bid Opening Date

Technical bids will be opened and evaluated.

Upcoming · 13 days

Tender Documents

Download All (ZIP) ↓
html

a32b890f-c547-4421-a101-13026f73bb9f.html

xls

BOQ_888144.xls

pdf

RFP2627094.pdf

pdf

Tendernotice_1.pdf

Disclaimer

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