Bids Are Invited For Head Assy , Lan Card , Ups Bty 12V7Ah , Pressure Roller , Teflon Sleeve , Monitor , Hard Disc1Tb , Processor I5 12 Gen , Mother Board H610 , Ram 16 Gb Ddr4 , Ups 1Kva , Smps
Tender Value
Ref. Documents
Estimated cost
Bid Submission
10 Oct 2026
5 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem
Tender Overview
Organization
Tender ID
Competition Type
NCB
Bidding Type
Tender
Location / State
ri bhoi → Meghalaya
EMD Exemption
Not Available
Quantity
23
Website
Contact Person
Address
Project Description
Bids Are Invited For Head Assy , Lan Card , Ups Bty 12V7Ah , Pressure Roller , Teflon Sleeve , Monitor , Hard Disc1Tb , Processor I5 12 Gen , Mother Board H610 , Ram 16 Gb Ddr4 , Ups 1Kva , Smps
BOQ
| Sl. No. | Item Title | Item Description |
| 1 | Head assy | Head assy |
| 2 | LAN Card | LAN Card |
| 3 | UPS Bty 12V7AH | UPS Bty 12V7AH |
| 4 | Pressure Roller | Pressure Roller |
| 5 | Teflon Sleeve | Teflon Sleeve |
| 6 | Monitor | Monitor |
| 7 | Hard Disc1TB | Hard Disc1TB |
| 8 | Processor I5 12 Gen | Processor I5 12 Gen |
| 9 | Mother Board H610 | Mother Board H610 |
| 10 | Ram 16 GB DDR4 | Ram 16 GB DDR4 |
| 11 | UPS 1KVA | UPS 1KVA |
| 12 | SMPS | SMPS |
AI Tender Summary
Tender Timeline
Sep 30, 2026
11:30 IST
Tender Published
Tender notice published.
CompletedOct 10, 2026
17:00 IST
Bid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 5 daysOct 11, 2026
Bid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 6 daysTender Documents
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