Bids Are invited for Boq Boq
Tender Overview
Project Description
Bids Are invited for Mobile With A19 Pro Chip 256 Gb , Laptop With M5 Chipset 512 Gb , Laptop With A18 Pro Processor 512 Gb , Tab With Hexagonal S Pen, Amoled 2X 512 Gb , Laptop With X Plus Processor, Type Cover 256 Gb , Laptop With Intel Core Ultra 5, 512 Gb , Laptop 13Th Gen 512 Gb
BOQ
| Sl. No. | Item Title | Item Description |
| 1 | Mobile with A19 Pro Chip 256 GB | Mobile with A19 Pro Chip 256 GB |
| 2 | Laptop with M5 Chipset 512 GB | Laptop with M5 Chipset 512 GB |
| 3 | Laptop with A18 pro Processor 512 GB | Laptop with A18 pro Processor 512 GB |
| 4 | Tab with Hexagonal S pen, AMOLED 2X 512 GB | Tab with Hexagonal S pen, AMOLED 2X 512 GB |
| 5 | Laptop with X plus processor, type cover 256 GB | Laptop with X plus processor, type cover 256 GB |
| 6 | Laptop with Intel core Ultra 5, 512 GB | Laptop with Intel core Ultra 5, 512 GB |
| 7 | Laptop 13th Gen 512 GB | Laptop 13th Gen 512 GB |
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 4 daysBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 5 daysTender Documents
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