Bids Are invited for 51178610 18 Layer- 2.3M± 10% Foilmethod, Jd3mc Carrier Card P/N M1020102003 Pkg Micropack , 51178197 12 Layer-1.6Mm-Foilmethod, Jd3mc Iotp1 Card P/N M1020107001 Rev 00 Pkg Micro Pack , 51178274 14 Layer-2.33Mm-Foilmethod, Jd3mc G
Tender Overview
Project Description
Bids Are invited for 51178610 18 Layer- 2.3M± 10% Foilmethod, Jd3mc Carrier Card P/N M1020102003 Pkg Micropack , 51178197 12 Layer-1.6Mm-Foilmethod, Jd3mc Iotp1 Card P/N M1020107001 Rev 00 Pkg Micro Pack , 51178274 14 Layer-2.33Mm-Foilmethod, Jd3mc Graphics Card P/N: M1020103002, M/S. Micropack
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Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 20 daysBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 21 daysTender Documents
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