Defence Government Departments Closing in 26 days TDR #57430038

Bids Are invited for High Performance And Artificial Intelligence Computing Infrastructure Of Deal - High Performance & Artificial Intelligence Computing Infrastructure Of Deal , High Performance Compute (Hpc) Cluster Nodes , Master / Head Nodes (Ai

Issued by Government Departments · Dehradun, Uttarakhand
Tender Value
Ref. Documents
Estimated cost
Bid Submission
07 Oct 2026
26 days left
EMD
1.65 Crore
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem

Tender Overview

Organization
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Tender ID
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Competition Type
NCB
Bidding Type
Tender
Location / State
Dehradun → Uttarakhand
EMD Exemption
Available
Quantity
1
Website
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Contact Person
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Address
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Project Description

Bids Are invited for High Performance And Artificial Intelligence Computing Infrastructure Of Deal - High Performance & Artificial Intelligence Computing Infrastructure Of Deal , High Performance Compute (Hpc) Cluster Nodes , Master / Head Nodes (Ai + Hpc + Storage) , Parallel File System (Pfs) Nvme Appliance , Archival Storage , Primary Infiniband Fabric (Ndr 400Gb/S) , Secondary Interconnect Switch , Management Switch (1Gbe) , Ai Gpu Server (8‑Gpu High‑Memory) , Modular Datacenter With Smart In‑Row Cooling + Rack Pdus + Ups , Cabling, Transceivers, Optics, Dacs , Installation, Commissioning, Training And Product Support , Single Sign-On Dashboard , Backup And Data Mover Software

BOQ

Sl. No. Item TitleItem Description
1High Performance & Artificial Intelligence Computing Infrastructure of DEALHigh Performance & Artificial Intelligence Computing Infrastructure of DEAL
2High Performance Compute (HPC) cluster nodesHigh Performance Compute (HPC) cluster nodes
3Master / Head Nodes (AI + HPC + Storage)Master / Head Nodes (AI + HPC + Storage)
4Parallel File System (PFS) NVMe applianceParallel File System (PFS) NVMe appliance
5Archival storageArchival storage
6Primary InfiniBand fabric (NDR 400Gb/s)Primary InfiniBand fabric (NDR 400Gb/s)
7Secondary Interconnect SwitchSecondary Interconnect Switch
8Management switch (1GbE)Management switch (1GbE)
9AI GPU Server (8‑GPU high‑memory)AI GPU Server (8‑GPU high‑memory)
10Modular Datacenter with Smart In‑Row Cooling + Rack PDUs + UPSModular Datacenter with Smart In‑Row Cooling + Rack PDUs + UPS
11Cabling, transceivers, optics, DACsCabling, transceivers, optics, DACs
12Installation, commissioning, training and product supportInstallation, commissioning, training and product support
13Single sign-on dashboardSingle sign-on dashboard
14Backup and Data Mover SoftwareBackup and Data Mover Software

AI Tender Summary

OUR REF NO 57430038
AUTHORITY Government Departments
TENDER VALUE Ref. Documents
LAST DATE 07-10-2026
Authority
Authority Name Department Of Defence Research And Development
Work Description Bids Are invited for High Performance And Artificial Intelligence Computing Infrastructure Of Deal - High Performance & Artificial Intelligence Computing Infrastructure Of Deal , High Performance Compute (Hpc) Cluster Nodes , Master / Head Nodes (Ai + Hpc + Storage) , Parallel File System (Pfs) Nvme Appliance , Archival Storage , Primary Infiniband Fabric (Ndr 400Gb/S) , Secondary Interconnect Switch , Management Switch (1Gbe) , Ai Gpu Server (8‑Gpu High‑Memory) , Modular Datacenter With Smart In‑Row Cooling + Rack Pdus + Ups , Cabling, Transceivers, Optics, Dacs , Installation, Commissioning, Training And Product Support , Single Sign-On Dashboard , Backup And Data Mover Software
Basic Detail
Tender No GEM/2026/B/7802725
Bidding Type Tender
Location
City Dehradun
State Uttarakhand
Key Dates
Publish Date 09 Sep 2026
Submission Date 07 Oct 2026
Open Date 08 Oct 2026
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD 1.65 Crore
Exemption Available
Document List
8300d84e-aeb6-4734-a201-e52d12d7c684.pdf
1788432068.xlsx
hpc_ai_techspec_2026-07-17-17-02-51_90f599308003ffb2d45774c7966a0ec3.pdf
0309rfPCIP_c31f577a-be30-4344-9c131788435479586_sumitjakhmola.pdf
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Tender Timeline

Sep 09, 2026
11:30 IST

Tender Published

Tender notice published.

Completed
Oct 07, 2026
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Upcoming · 26 days
Oct 08, 2026

Bid Opening Date

Technical bids will be opened and evaluated.

Upcoming · 27 days

Tender Documents

Download All (ZIP) ↓
pdf

8300d84e-aeb6-4734-a201-e52d12d7c684.pdf

xlsx

1788432068.xlsx

pdf

hpc_ai_techspec_2026-07-17-17-02-51_90f599308003ffb2d45774c7966a0ec3.pdf

pdf

0309rfPCIP_c31f577a-be30-4344-9c131788435479586_sumitjakhmola.pdf

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