Bids Are invited for Pre-Prototype Hardware And Software , Fully Tested Prototype Version Of H-1 Device , Rfid Smart Cards , Fully Tested Prototype Version Of H-2 Device Along With Dc Power Adaptor , Electronic Door Lock , Fully Tested Prototype Vers
Tender Overview
Project Description
Bids Are invited for Pre-Prototype Hardware And Software , Fully Tested Prototype Version Of H-1 Device , Rfid Smart Cards , Fully Tested Prototype Version Of H-2 Device Along With Dc Power Adaptor , Electronic Door Lock , Fully Tested Prototype Version Of H-3 Device
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 10 daysBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 11 daysTender Documents
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