Bids Are invited for Ram8gb Ddr4 , Motherboardh310 , Motherboardh510 , Teflon Sleeve , Developer Unit 438N
Tender Value
Ref. Documents
Estimated cost
Bid Submission
03 Sep 2026
1 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem
Tender Overview
Organization
Tender ID
Competition Type
NCB
Bidding Type
Tender
Location / State
Ahmedabad → Gujarat
EMD Exemption
Not Available
Quantity
15
Website
Contact Person
Address
Project Description
Bids Are invited for Ram8gb Ddr4 , Motherboardh310 , Motherboardh510 , Teflon Sleeve , Developer Unit 438N
BOQ
| Sl. No. | Item Title | Item Description |
| 1 | RAM8GB DDR4 | As per Technical Specifications |
| 2 | MotherboardH310 | As per Technical Specifications |
| 3 | MotherboardH510 | As per Technical Specifications |
| 4 | Teflon Sleeve | As per Technical Specifications |
| 5 | Developer Unit 438N | As per Technical Specifications |
AI Tender Summary
Tender Timeline
Aug 24, 2026
11:30 IST
Tender Published
Tender notice published.
CompletedSep 03, 2026
17:00 IST
Bid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 1 daySep 03, 2026
Bid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 1 dayTender Documents
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