Defence Statutory Bodies & Commissions/Committees Closing in 14 days TDR #57164780

Bids Are invited for Verification And Reverse Engineering Facility In Vlsi And Nanoelectronics Laboratory

Issued by Statutory Bodies & Commissions/Committees · Indore, Madhya Pradesh
Tender Value
Ref. Documents
Estimated cost
Bid Submission
12 Sep 2026
14 days left
EMD
4 Lakhs
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem

Tender Overview

Competition Type
NCB
Bidding Type
Tender
Location / State
Indore → Madhya Pradesh
EMD Exemption
Available
Quantity
13

Project Description

Bids Are invited for Verification And Reverse Engineering Facility In Vlsi And Nanoelectronics Laboratory Bga_Smt Rework System 2300 W - Bga/Smt Rework System 2300 W , Hot Air Station 900W , Infrared Preheating Plate 1200 W, 230 V With Easy Fix Board Holder , Usb Microscope With Digital Camera And Adjustable Work Stand , 1-Channel Soldering Station Set, Digital 95 W With Soldering Iron Wsp 80 , Universal Programmer , Advanced Flash Data Recovery Tool , Chip-Off Kit , Digital Ultrasonic Cleaning System , Advanced Arm Cortex-M Real-Time Trace And Debug Probe - Advanced Arm Cortex-M Real-Time Trace & Debug Probe , Advanced Side-Channel Analysis - Fault Injection Platform - Advanced Side-Channel Analysis & Fault Injection Platform , U1250 Series Handheld Digital Multimeter , Installation And Training

BOQ

Sl. No. Item TitleItem Description
1BGA_SMT Rework system 2300 WBGA/SMT Rework system 2300 W
2Hot Air Station 900WHot Air Station 900W
3Infrared preheating plate 1200 W, 230 V with Easy Fix board holderInfrared preheating plate 1200 W, 230 V with Easy Fix board holder
4USB Microscope with digital camera and adjustable work standUSB Microscope with digital camera and adjustable work stand
51-Channel Soldering Station Set, digital 95 W with soldering iron WSP 801-Channel Soldering Station Set, digital 95 W with soldering iron WSP 80
6Universal ProgrammerUniversal Programmer
7Advanced Flash Data Recovery ToolAdvanced Flash Data Recovery Tool
8Chip-off KitChip-off Kit
9Digital Ultrasonic Cleaning SystemDigital Ultrasonic Cleaning System
10Advanced ARM Cortex-M Real-Time Trace and Debug ProbeAdvanced ARM Cortex-M Real-Time Trace & Debug Probe
11Advanced Side-Channel Analysis - Fault Injection PlatformAdvanced Side-Channel Analysis & Fault Injection Platform
12U1250 Series handheld Digital multimeterU1250 Series handheld Digital multimeter
13Installation and TrainingInstallation and Training

AI Tender Summary

OUR REF NO 57164780
AUTHORITY Statutory Bodies & Commissions/Committees
TENDER VALUE Ref. Documents
LAST DATE 12-09-2026
Authority
Authority Name Indian Army
Work Description Bids Are invited for Verification And Reverse Engineering Facility In Vlsi And Nanoelectronics Laboratory Bga_Smt Rework System 2300 W - Bga/Smt Rework System 2300 W , Hot Air Station 900W , Infrared Preheating Plate 1200 W, 230 V With Easy Fix Board Holder , Usb Microscope With Digital Camera And Adjustable Work Stand , 1-Channel Soldering Station Set, Digital 95 W With Soldering Iron Wsp 80 , Universal Programmer , Advanced Flash Data Recovery Tool , Chip-Off Kit , Digital Ultrasonic Cleaning System , Advanced Arm Cortex-M Real-Time Trace And Debug Probe - Advanced Arm Cortex-M Real-Time Trace & Debug Probe , Advanced Side-Channel Analysis - Fault Injection Platform - Advanced Side-Channel Analysis & Fault Injection Platform , U1250 Series Handheld Digital Multimeter , Installation And Training
Basic Detail
Tender No GEM/2026/B/7774041
Bidding Type Tender
Location
City Indore
State Madhya Pradesh
Key Dates
Publish Date 22 Aug 2026
Submission Date 12 Sep 2026
Open Date 12 Sep 2026
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD 4 Lakhs
Exemption Available
Document List
0f8b1cbf-d5de-4de7-ac60-584e73aaceab.pdf
9591941_Boq_1.xlsx
ATC_195e77c0-d183-4a48-8c741783833440706_fce_projcoordinator.doc
tech_spec_vlsi_2026-07-10-20-23-12_04cc79fbcb5cdc9d513fcfcd4a7ea223.pdf

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Tender Timeline

Aug 22, 2026
11:30 IST

Tender Published

Tender notice published.

Completed
Sep 12, 2026
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Upcoming · 14 days
Sep 12, 2026

Bid Opening Date

Technical bids will be opened and evaluated.

Upcoming · 14 days

Tender Documents

Download All (ZIP) ↓
pdf

0f8b1cbf-d5de-4de7-ac60-584e73aaceab.pdf

xlsx

9591941_Boq_1.xlsx

doc

ATC_195e77c0-d183-4a48-8c741783833440706_fce_projcoordinator.doc

pdf

tech_spec_vlsi_2026-07-10-20-23-12_04cc79fbcb5cdc9d513fcfcd4a7ea223.pdf

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