Defence Statutory Bodies & Commissions/Committees Closing in 7 days TDR #57126450

Bids Are Invited For Processor Cpu Intel I3 12Th Generation , Compatible Motherboard I3 12Th Generation Support , Compatible Smps I3 12Th Generation Support , Power Cable For Pc , Vga Cable For Pc , Teflon Sleeve For Laser Printer

Issued by Statutory Bodies & Commissions/Committees · udhampur, Jammu and Kashmir
Tender Value
Ref. Documents
Estimated cost
Bid Submission
31 Aug 2026
7 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem

Tender Overview

Organization
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Tender ID
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Competition Type
NCB
Bidding Type
Tender
Location / State
udhampur → Jammu and Kashmir
EMD Exemption
Available
Quantity
21
Website
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Contact Person
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Address
Click here to view address

Project Description

Bids Are Invited For Processor Cpu Intel I3 12Th Generation , Compatible Motherboard I3 12Th Generation Support , Compatible Smps I3 12Th Generation Support , Power Cable For Pc , Vga Cable For Pc , Teflon Sleeve For Laser Printer

BOQ

Sl. No. Item TitleItem Description
1Processor CPU intel i3 12th GenerationProcessor CPU intel i3 12th Generation
2Compatible Motherboard i3 12th Generation SupportCompatible Motherboard i3 12th Generation Support
3Compatible SMPS i3 12th Generation SupportCompatible SMPS i3 12th Generation Support
4Power Cable for PCPower Cable for PC
5VGA Cable for PCVGA Cable for PC
6Teflon Sleeve for Laser PrinterTeflon Sleeve for Laser Printer

AI Tender Summary

OUR REF NO 57126450
AUTHORITY Statutory Bodies & Commissions/Committees
TENDER VALUE Ref. Documents
LAST DATE 31-08-2026
Authority
Authority Name Indian Army
Work Description Bids Are Invited For Processor Cpu Intel I3 12Th Generation , Compatible Motherboard I3 12Th Generation Support , Compatible Smps I3 12Th Generation Support , Power Cable For Pc , Vga Cable For Pc , Teflon Sleeve For Laser Printer
Basic Detail
Tender No GEM/2026/B/7897208
Bidding Type Tender
Location
City udhampur
State Jammu and Kashmir
Key Dates
Publish Date 20 Aug 2026
Submission Date 31 Aug 2026
Open Date 31 Aug 2026
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD Ref. Documents
Exemption Available
Document List
79c01232-b106-4806-ab6f-bee672c1edb2.pdf
9732787_Boq_1.xlsx
BOQ1_e0349d29-3f07-4a7b-a4a01786343869138_Acct_offr_16.pdf
tech_spec_it_maint_2026-08-10-11-58-12_89a5063d41dadb66eae53780f0549b11.pdf
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Tender Timeline

Aug 20, 2026
11:30 IST

Tender Published

Tender notice published.

Completed
Aug 31, 2026
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Upcoming · 7 days
Aug 31, 2026

Bid Opening Date

Technical bids will be opened and evaluated.

Upcoming · 7 days

Tender Documents

Download All (ZIP) ↓
pdf

79c01232-b106-4806-ab6f-bee672c1edb2.pdf

xlsx

9732787_Boq_1.xlsx

pdf

BOQ1_e0349d29-3f07-4a7b-a4a01786343869138_Acct_offr_16.pdf

pdf

tech_spec_it_maint_2026-08-10-11-58-12_89a5063d41dadb66eae53780f0549b11.pdf

Disclaimer

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