Defence Statutory Bodies & Commissions/Committees Closing in 8 days TDR #57117482

Bids Are invited for Procurement Of Items For Ipc Lab

Issued by Statutory Bodies & Commissions/Committees · Ranga Reddy, Telangana
Tender Value
Ref. Documents
Estimated cost
Bid Submission
31 Aug 2026
8 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem

Tender Overview

Organization
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Tender ID
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Competition Type
NCB
Bidding Type
Tender
Location / State
Ranga Reddy → Telangana
EMD Exemption
Available
Quantity
892
Website
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Contact Person
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Address
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Project Description

Bids Are invited for Procurement Of Items For Ipc Lab Solder Soft 60 40 , Epoxy Resin 0.5 Ltr , Conformal Coating 400 Ml , Epoxy Hardner 0.5 Ltr , Liquid Flux 0.5 Ltr , Defluxer , Bread Board , Anti-Static Spray , Eyelets 116 X 0.93 , Solder Soft 63 37 , Epoxy Agent For Pcb Repair , Cleaning Sponge For Tip Metal Wire , Wire Cutter , Plastic Polymid Tape , 1.55 Mm Wire For Splicing , Normal Flux , De-Soldring Wick , Eyeles Various Size , Metal Eyelet For Pcb Hole Repair , Fm Receiver With Component , Infracted Int Alarm , Ir Remote Control On Off Sw , Home Appliances Controlled Ir Remote , Water Level Control , Anti-Burglar Alarm Kit , Fire Alarm Using Thermistor And 555Ic , Mobile Bug , Digital Security Alarm , Rain Alarm , Cleaning Sponge For Tip

BOQ

Sl. No. Item TitleItem Description
1Solder Soft 60 40Solder Soft 60 40
2Epoxy Resin 0.5 LtrEpoxy Resin 0.5 Ltr
3Conformal Coating 400 mlConformal Coating 400 ml
4Epoxy Hardner 0.5 LtrEpoxy Hardner 0.5 Ltr
5Liquid Flux 0.5 LtrLiquid Flux 0.5 Ltr
6DefluxerDefluxer
7Bread BoardBread Board
8Anti-Static SprayAnti-Static Spray
9Eyelets 116 x 0.93Eyelets 116 x 0.93
10Solder Soft 63 37Solder Soft 63 37
11Epoxy agent for PCB repairEpoxy agent for PCB repair
12Cleaning Sponge for Tip Metal wireCleaning Sponge for Tip Metal wire
13Wire cutterWire cutter
14Plastic Polymid tapePlastic Polymid tape
151.55 mm Wire for Splicing1.55 mm Wire for Splicing
16Normal FluxNormal Flux
17De-Soldring WickDe-Soldring Wick
18Eyeles Various SizeEyeles Various Size
19Metal eyelet for PCB hole repairMetal eyelet for PCB hole repair
20FM Receiver with ComponentFM Receiver with Component
21Infracted INT AlarmInfracted INT Alarm
22IR Remote Control On Off SwIR Remote Control On Off Sw
23Home Appliances Controlled IR RemoteHome Appliances Controlled IR Remote
24Water Level ControlWater Level Control
25Anti-Burglar Alarm KitAnti-Burglar Alarm Kit
26Fire Alarm using Thermistor and 555ICFire Alarm using Thermistor and 555IC
27Mobile BugMobile Bug
28Digital Security AlarmDigital Security Alarm
29Rain AlarmRain Alarm
30Cleaning Sponge for TipCleaning Sponge for Tip

AI Tender Summary

OUR REF NO 57117482
AUTHORITY Statutory Bodies & Commissions/Committees
TENDER VALUE Ref. Documents
LAST DATE 31-08-2026
Authority
Authority Name Indian Army
Work Description Bids Are invited for Procurement Of Items For Ipc Lab Solder Soft 60 40 , Epoxy Resin 0.5 Ltr , Conformal Coating 400 Ml , Epoxy Hardner 0.5 Ltr , Liquid Flux 0.5 Ltr , Defluxer , Bread Board , Anti-Static Spray , Eyelets 116 X 0.93 , Solder Soft 63 37 , Epoxy Agent For Pcb Repair , Cleaning Sponge For Tip Metal Wire , Wire Cutter , Plastic Polymid Tape , 1.55 Mm Wire For Splicing , Normal Flux , De-Soldring Wick , Eyeles Various Size , Metal Eyelet For Pcb Hole Repair , Fm Receiver With Component , Infracted Int Alarm , Ir Remote Control On Off Sw , Home Appliances Controlled Ir Remote , Water Level Control , Anti-Burglar Alarm Kit , Fire Alarm Using Thermistor And 555Ic , Mobile Bug , Digital Security Alarm , Rain Alarm , Cleaning Sponge For Tip
Basic Detail
Tender No GEM/2026/B/7854562
Bidding Type Tender
Location
City Ranga Reddy
State Telangana
Key Dates
Publish Date 20 Aug 2026
Submission Date 31 Aug 2026
Open Date 31 Aug 2026
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD Ref. Documents
Exemption Available
Document List
c8c59de2-428b-4b6f-a8f2-4a5b80e443cc.pdf
9684041_Boq_1.xlsx
tech_spec_ipc_2026-07-30-13-30-07_603eebb0b7949aea076438f767423a2e.pdf
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Tender Timeline

Aug 20, 2026
11:30 IST

Tender Published

Tender notice published.

Completed
Aug 31, 2026
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Upcoming · 8 days
Aug 31, 2026

Bid Opening Date

Technical bids will be opened and evaluated.

Upcoming · 8 days

Tender Documents

Download All (ZIP) ↓
pdf

c8c59de2-428b-4b6f-a8f2-4a5b80e443cc.pdf

xlsx

9684041_Boq_1.xlsx

pdf

tech_spec_ipc_2026-07-30-13-30-07_603eebb0b7949aea076438f767423a2e.pdf

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