Defence Statutory Bodies & Commissions/Committees Closing in 1 days TDR #57026006

Bids Are invited for Motherboard

Issued by Statutory Bodies & Commissions/Committees · Jammu, Jammu and Kashmir
Tender Value
Ref. Documents
Estimated cost
Bid Submission
25 Aug 2026
1 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem

Tender Overview

Competition Type
NCB
Bidding Type
Tender
Location / State
Jammu → Jammu and Kashmir
EMD Exemption
Not Available
Quantity
12

Project Description

Bids Are invited for Motherboard Motherboard , Logic Card , Power Supply , Main Board Hp Mfp , Opc Drum , Cleaning Blade , Taflon Sleeve , Printer Gear Set , Canon Heat Roller , Maintenance Box , Ssd 256 Gb

BOQ

Sl. No. Item TitleItem Description
1MOTHERBOARDMOTHERBOARD
2LOGIC CARDLOGIC CARD
3POWER SUPPLYPOWER SUPPLY
4MAIN BOARD HP MFPMAIN BOARD HP MFP
5OPC DRUMOPC DRUM
6CLEANING BLADECLEANING BLADE
7TAFLON SLEEVETAFLON SLEEVE
8PRINTER GEAR SETPRINTER GEAR SET
9CANON HEAT ROLLERCANON HEAT ROLLER
10MAINTENANCE BOXMAINTENANCE BOX
11SSD 256 GBSSD 256 GB

AI Tender Summary

OUR REF NO 57026006
AUTHORITY Statutory Bodies & Commissions/Committees
TENDER VALUE Ref. Documents
LAST DATE 25-08-2026
Authority
Authority Name Indian Army
Work Description Bids Are invited for Motherboard Motherboard , Logic Card , Power Supply , Main Board Hp Mfp , Opc Drum , Cleaning Blade , Taflon Sleeve , Printer Gear Set , Canon Heat Roller , Maintenance Box , Ssd 256 Gb
Basic Detail
Tender No GEM/2026/B/7922147
Bidding Type Tender
Location
City Jammu
State Jammu and Kashmir
Key Dates
Publish Date 15 Aug 2026
Submission Date 25 Aug 2026
Open Date 25 Aug 2026
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD Ref. Documents
Exemption Not Available
Document List
4be2f3b1-2305-4edc-9fcc-604c0d717991.pdf
9761199_Boq_1.xlsx
description_motherboard_2026-08-15-12-15-13_3796c2f160601f700209e0957934fe31.pdf

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Tender Timeline

Aug 15, 2026
11:30 IST

Tender Published

Tender notice published.

Completed
Aug 25, 2026
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Upcoming · 1 day
Aug 25, 2026

Bid Opening Date

Technical bids will be opened and evaluated.

Upcoming · 1 day

Tender Documents

Download All (ZIP) ↓
pdf

4be2f3b1-2305-4edc-9fcc-604c0d717991.pdf

xlsx

9761199_Boq_1.xlsx

pdf

description_motherboard_2026-08-15-12-15-13_3796c2f160601f700209e0957934fe31.pdf

Disclaimer

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