Defence Statutory Bodies & Commissions/Committees Closing in 3 days TDR #56988899

Bids Are invited for Laptop With Snapdragon Qualcom X Plus Chip, 10 Core Cpu, 16 Gb Ram, 256 Gb Ssd, 13 Lcd Touch Screen , Laptop With M4 Chip, 10 Core Cpu, 8 Core Gpu, 8 Gb Ram, 256 Gb Storage, 13 Display Mac Os, 1 Year W

Issued by Statutory Bodies & Commissions/Committees · Ambala, Haryana
Tender Value
Ref. Documents
Estimated cost
Bid Submission
03 Sep 2026
3 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem

Tender Overview

Organization
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Tender ID
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Competition Type
NCB
Bidding Type
Tender
Location / State
Ambala → Haryana
EMD Exemption
Not Available
Quantity
3
Website
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Contact Person
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Address
Click here to view address

Project Description

Bids Are invited for Laptop With Snapdragon Qualcom X Plus Chip, 10 Core Cpu, 16 Gb Ram, 256 Gb Ssd, 13 Lcd Touch Screen , Laptop With M4 Chip, 10 Core Cpu, 8 Core Gpu, 8 Gb Ram, 256 Gb Storage, 13 Display Mac Os, 1 Year W

AI Tender Summary

OUR REF NO 56988899
AUTHORITY Statutory Bodies & Commissions/Committees
TENDER VALUE Ref. Documents
LAST DATE 03-09-2026
Authority
Authority Name Indian Army
Work Description Bids Are invited for Laptop With Snapdragon Qualcom X Plus Chip, 10 Core Cpu, 16 Gb Ram, 256 Gb Ssd, 13 Lcd Touch Screen , Laptop With M4 Chip, 10 Core Cpu, 8 Core Gpu, 8 Gb Ram, 256 Gb Storage, 13 Display Mac Os, 1 Year W
Basic Detail
Tender No GEM/2026/B/7784262
Bidding Type Tender
Location
City Ambala
State Haryana
Key Dates
Publish Date 13 Aug 2026
Submission Date 03 Sep 2026
Open Date 03 Sep 2026
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD Ref. Documents
Exemption Not Available
Document List
5e4ad51c-ec3b-4c20-9a60-2231e4c60e99.pdf
tech_spec_laptop_2026-07-14-12-24-23_9d90f43a04f57754ede8648ae5e7baf3.pdf
tech_spec_laptop_2026-07-14-12-26-26_9290733348aa3bf53c5bbf3b82413370.pdf
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Tender Timeline

Aug 13, 2026
11:30 IST

Tender Published

Tender notice published.

Completed
Sep 03, 2026
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Upcoming · 3 days
Sep 03, 2026

Bid Opening Date

Technical bids will be opened and evaluated.

Upcoming · 3 days

Tender Documents

Download All (ZIP) ↓
pdf

5e4ad51c-ec3b-4c20-9a60-2231e4c60e99.pdf

pdf

tech_spec_laptop_2026-07-14-12-24-23_9d90f43a04f57754ede8648ae5e7baf3.pdf

pdf

tech_spec_laptop_2026-07-14-12-26-26_9290733348aa3bf53c5bbf3b82413370.pdf

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