Bids Are invited for Anti Hbc Igm Elecsys Kit
Tender Overview
Project Description
Bids Are invited for Anti Hbc Igm Elecsys Kit Anti Hbc Igm Elecsys Kit - Ige Elecsys Kit For Testing Of Patient S Les , Anti Hbs Elecsys Kit - Anti Hbs Elecsys Kit For Testing Of Patient S Les , Assay Cup - Cups For Processing Of Tests , Assay Tip - Tips For Processing Of S Les , Ultrapure - Deionised Water , Precontrol Anti Hcv - Quality Control For Hcv Test , Precontrol Hbsag - Quality Control For Hbsag Test , Cleancell - Auxillary Reagent 1 For Processing Of S Les , Procell - Auxillary Reagent 2 For Processing Of S Les , Anti Ds Dna Elisa Kit - Dsdna Elisa Kit For For Testing Of Patient S Les , Leptospira Rapid Card - Leptospira Rapid Card For Testing Of Patient S Les , Scrub Typhus Rapid Card - Scrub Typhus Rapid Card For Testing Of Patient S Les , Syswash - Cleaning Solution For Cobas E 411 , Universal Diluent - S Le Diluent , Ise Cleaning Solution - Cleaing Solution For Lfc Purpose
BOQ
| Sl. No. | Item Title | Item Description |
| 1 | ANTI HBc IGM ELECSYS KIT | IGE ELECSYS KIT FOR TESTING OF PATIENT SAMPLES |
| 2 | ANTI HBS ELECSYS KIT | ANTI HBS ELECSYS KIT FOR TESTING OF PATIENT SAMPLES |
| 3 | ASSAY CUP | CUPS FOR PROCESSING OF TESTS |
| 4 | ASSAY TIP | TIPS FOR PROCESSING OF SAMPLES |
| 5 | ULTRAPURE | DEIONISED WATER |
| 6 | PRECONTROL ANTI HCV | QUALITY CONTROL FOR HCV TEST |
| 7 | PRECONTROL HBSAG | QUALITY CONTROL FOR HBSAG TEST |
| 8 | CLEANCELL | AUXILLARY REAGENT 1 FOR PROCESSING OF SAMPLES |
| 9 | PROCELL | AUXILLARY REAGENT 2 FOR PROCESSING OF SAMPLES |
| 10 | ANTI DS DNA ELISA KIT | DSDNA ELISA KIT FOR FOR TESTING OF PATIENT SAMPLES |
| 11 | LEPTOSPIRA RAPID CARD | LEPTOSPIRA RAPID CARD FOR TESTING OF PATIENT SAMPLES |
| 12 | SCRUB TYPHUS RAPID CARD | SCRUB TYPHUS RAPID CARD FOR TESTING OF PATIENT SAMPLES |
| 13 | SYSWASH | CLEANING SOLUTION FOR COBAS E 411 |
| 14 | UNIVERSAL DILUENT | SAMPLE DILUENT |
| 15 | ISE CLEANING SOLUTION | CLEAING SOLUTION FOR LFC PURPOSE |
AI Tender Summary
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Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 8 daysBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 8 daysTender Documents
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