Tender For Fuse, 550 A, 660 V Ac, High-Speed Semiconductor Type, Eaton Bussmann Make, Part No. 170M4465, Or Mersen Make, Part No. 6,9Urd31Ttf0550 (Pc31Ud69V550Tf), Or Equivalent, Approved By Icf/Rdso.
Tender Value
Ref. Documents
Estimated cost
Bid Submission
18 Aug 2026
2 days left
EMD
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Bank guarantee accepted
Document Fee
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Non-refundable
Tender Type
Online
Tender Overview
Organization
Tender ID
Competition Type
NCB
Bidding Type
Tender
Location / State
Bhopal → Madhya Pradesh
EMD Exemption
Not Available
Quantity
Not Available
Website
Contact Person
Address
Project Description
Tender For Fuse, 550 A, 660 V Ac, High-Speed Semiconductor Type, Eaton Bussmann Make, Part No. 170M4465, Or Mersen Make, Part No. 6,9Urd31Ttf0550 (Pc31Ud69V550Tf), Or Equivalent, Approved By Icf/Rdso.
BOQ
| Sl. No. | Item Description |
| 1 | FUSE 550A, 660V |
| 2 | FUSE, 550 A, 660 V AC, HIGH-SPEED SEMICONDUCTOR TYPE, EATON BUSSMANN MAKE, PART NO. 170M4465, OR MERSEN MAKE, PART NO. 6,9URD31TTF0550 (PC31UD69V550TF), OR EQUIVALENT, APPROVED BY ICF/RDSO. Please Enable Macros to View BoQ information |
AI Tender Summary
Tender Timeline
Aug 07, 2026
11:30 IST
Tender Published
Tender notice published.
CompletedAug 18, 2026
17:00 IST
Bid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 2 daysAug 18, 2026
Bid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 2 daysTender Documents
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