Bids Are invited for Repair, Maintenance, And Installation Of Plant/ Systems/Equipments (Version 2) - Naval Dockyard; Repair Rate Agreement For Proving Of Air Pressure Test Of Compartment Clusters Onboard In Ships For Two Years; Service Provider - Fo
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Project Description
Bids Are invited for Repair, Maintenance, And Installation Of Plant/ Systems/Equipments (Version 2) - Naval Dockyard; Repair Rate Agreement For Proving Of Air Pressure Test Of Compartment Clusters Onboard In Ships For Two Years; Service Provider - For Services :-Air Pressure Testing (Apt) Of Underwater Compartment Clusters Including Blanking, Rectification Of Associated Structural Defects. , For Services :-Air Hose Test (Aht) Of Underwater Compartment Clusters Including Blanking, Rectification Of Associated Structural Defects. , For Materials : Mseal , For Materials : Mseal For General Purpose , For Materials : Mseal Anti Corrossive Epoxy Compound , For Materials : Silicon Putty , For Materials : Wet Putty , For Materials : Hemp Putty , For Materials : Powder Putty , For Materials : Devcon Sealing
BOQ
| Sl. No. | Item Title | Item Description |
| 1 | For Services :-Air pressure testing (APT) of underwater compartment clusters including blanking, rectification of associated structural defects. | For Services :-Air pressure testing (APT) of underwater compartment clusters including blanking, rectification of associated structural defects. |
| 2 | For Services :-Air Hose test (AHT) of underwater compartment clusters including blanking, rectification of associated structural defects. | For Services :-Air Hose test (AHT) of underwater compartment clusters including blanking, rectification of associated structural defects. |
| 3 | For Materials : MSEAL | For Materials : MSEAL |
| 4 | For Materials : MSEAL FOR GENERAL PURPOSE | For Materials : MSEAL FOR GENERAL PURPOSE |
| 5 | For Materials : MSEAL ANTI CORROSSIVE EPOXY COMPOUND | For Materials : MSEAL ANTI CORROSSIVE EPOXY COMPOUND |
| 6 | For Materials : SILICON PUTTY | For Materials : SILICON PUTTY |
| 7 | For Materials : WET PUTTY | For Materials : WET PUTTY |
| 8 | For Materials : HEMP PUTTY | For Materials : HEMP PUTTY |
| 9 | For Materials : POWDER PUTTY | For Materials : POWDER PUTTY |
| 10 | For Materials : DEVCON SEALING | For Materials : DEVCON SEALING |
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Upcoming · 19 daysBid Opening Date
Technical bids will be opened and evaluated.
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