Tender For Design, Supply, Installation, Testing, Commissioning, And Maintenance Of 800 Tflops Hybrid Cpu-Gpu Hpc Cluster At Iit Tirupati
Tender Overview
Project Description
Tender for Design, Supply, Installation, Testing, Commissioning, And Maintenance Of 800 Tflops Hybrid Cpu-Gpu Hpc Cluster At Iit Tirupati , Design, Supply, Installation, Testing, Commissioning, And Maintenance Of 800 Tflops Hybrid Cpu-Gpu Hpc Cluster At Iit Tirupati , Cpu Compute Nodes , High Memory Nodes , Gpu Compute Nodes , Service Nodes (Head Nodes, Login Nodes, Management Node) , Parallel File System & Components , Nas Storage , Primary Interconnect & Components , Secondary Interconnect & Components , System Software (Os, Scheduler, Cluster Management, Pfs, All Applicable Software & Licenses) , Installation, Integration And Commissioning , Training And Documentation , 5-Year Warranty Support , Year 6 Camc (Annual) , Year 7 Camc (Annual) , Any Additional Components (If Required)
Corrigendum
| Sr No | Corrigendum Date | Corrigendum | Type | New Submission Date |
|---|---|---|---|---|
| 1 | 10-Aug-2026 | Corrigendum 1 | Date | 29-Sep-2026 |
BOQ
| Sl. No. | Item Description |
| 1 | Design, Supply, Installation, Testing, Commissioning, and Maintenance of 800 TFlops Hybrid CPU-GPU HPC Cluster at IIT Tirupati |
| 2 | CPU Compute Nodes |
| 3 | High Memory Nodes |
| 4 | GPU Compute Nodes |
| 5 | Service Nodes(Head Nodes, Login Nodes, Management Node) |
| 6 | Parallel File System & Components |
| 7 | NAS Storage |
| 8 | Primary Interconnect & Components |
| 9 | Secondary Interconnect & Components |
| 10 | System Software(OS, Scheduler, Cluster Management, PFS, all applicable software & licenses) |
| 11 | Installation, Integration and Commissioning |
| 12 | Training and Documentation |
| 13 | 5-Year Warranty Support |
| 14 | Year 6 CAMC (Annual) |
| 15 | Year 7 CAMC (Annual) |
| 16 | Any Additional Components (if required) Please Enable Macros to View BoQ information |
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedCorrigendum-1 Issued
Clarifications on tender conditions and amendments issued.
Upcoming · 34 daysBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 34 daysBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 35 daysTender Documents
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