Total Quantity :
Tender Overview
Project Description
Bids Are Invited For Si/Sio2 Wafer Item #Hs39626-Ox: 4” P/Bo ≪100≫ .001-.005 Ohm-Cm; 500- 550Μm Thick Ssp Prime Grade Si Wafers W/ 2 Semi-Std Flats, 2850 A°±5% Dry Chlorinated Thermal Oxide On Both Sides And Forming Gas Anneal Total Quantity :
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 14 daysBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 14 daysTender Documents
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