Bids Are invited for Structure Frame , Acp Cladding Along With Installation Hardware , Acrylic Letters Along With Installation Hardwre , Letter Thickness , Led Modules , Led Drivers , Power Supply And Junction Box With Mcb
Tender Overview
Project Description
Bids Are invited for Structure Frame , Acp Cladding Along With Installation Hardware , Acrylic Letters Along With Installation Hardwre , Letter Thickness , Led Modules , Led Drivers , Power Supply And Junction Box With Mcb
BOQ
| Sl. No. | Item Title | Item Description |
| 1 | STRUCTURE FRAME | AS PER SOW PARA 1 SER NO 1 |
| 2 | ACP CLADDING ALONG WITH INSTALLATION HARDWARE | AS PER SOW PARA 1 SER NO 2 |
| 3 | ACRYLIC LETTERS ALONG WITH INSTALLATION HARDWRE | AS PER SOW PARA 1 SER NO 3 |
| 4 | LETTER THICKNESS | AS PER SOW PARA 1 SER NO 4 |
| 5 | LED MODULES | AS PER SOW PARA 1 SER NO 5 |
| 6 | LED DRIVERS | AS PER SOW PARA 1 SER NO 6 |
| 7 | POWER SUPPLY AND JUNCTION BOX WITH MCB | AS PER SOW PARA 1 SER NO 7 |
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 7 daysBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 7 daysTender Documents
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