Bids Are invited for Wired Headphones, Earphones And Communication Headsets (Q2) , Data Wall Display (Q2) , Audio Digital Signal Processor (Q3) , Audio Lifier (V3) (Under Bis Scheme - Ii) (Q2) , Conference Speakerphone Without Bluetooth (Q2) , Speake
Tender Overview
Project Description
Bids Are invited for Wired Headphones, Earphones And Communication Headsets (Q2) , Data Wall Display (Q2) , Audio Digital Signal Processor (Q3) , Audio Lifier (V3) (Under Bis Scheme - Ii) (Q2) , Conference Speakerphone Without Bluetooth (Q2) , Speaker (V3) (Q2) , Video Conferencing Camera / Web Camera (V2) (Q2) , Entry And Mid Level Desktop Computer (Q2)
AI Tender Summary
Tender Timeline
Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 19 daysBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 19 daysTender Documents
Download All (ZIP) ↓We takes all possible care for accurate & authentic tender information. However users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender