Bids Are invited for It Hardware Items
Tender Overview
Project Description
Bids Are invited for It Hardware Items High End Desktop Computer I7 Processor, 16 Gb Ram, 512 Gb Ssd, 512 Gb Hdd, Windows Os , High End Desktop Computer I7 Processor, 16 Gb Ram, 512 Gb Ssd, 512 Gb Hdd, Dos , Colour Inkjet Printer Auto Duplex Printing, 600 Dpi, Processor Speed 800 Mhz , Biometric Optical Fingerprint Scanning Technology, Usb 2.0 , Graphics Card Gpu 4 Gb Ddr6, Cuda Core 768, Hdcp 2.2 , 1 Kva Ups Battery Type Smf-Sealed Maintenance Free, Simulated Sine Wave , Conference Camera 1 Oblique 2.8 Inch Low Noise Cmos, 3D Digital Noise Reduction , 5 Kva Ups Igbt Switching Technology, Smf, 26 Ah Battery , Computer Workstation Core Ultra 9 Processor, 128 Gb Ram, 2 Tb Hdd, 1 Tb Ssd, 8 Gb Graphic Card Total Quantity : 81
BOQ
| Sl. No. | Item Title | Item Description |
| 1 | High End Desktop Computer i7 Processor, 16 GB RAM, 512 GB SSD, 512 GB HDD, Windows OS | As per technical specifications uploaded |
| 2 | High End Desktop Computer i7 Processor, 16 GB RAM, 512 GB SSD, 512 GB HDD, DOS | As per technical specifications uploaded |
| 3 | Colour Inkjet Printer Auto Duplex Printing, 600 DPI, Processor Speed 800 MHz | As per technical specifications uploaded |
| 4 | Biometric Optical Fingerprint Scanning Technology, USB 2.0 | As per technical specifications uploaded |
| 5 | Graphics Card GPU 4 GB DDR6, CUDA Core 768, HDCP 2.2 | As per technical specifications uploaded |
| 6 | 1 KVA UPS Battery Type SMF-Sealed Maintenance Free, Simulated Sine Wave | As per technical specifications uploaded |
| 7 | Conference Camera 1 Oblique 2.8 Inch low noise CMOS, 3D digital noise reduction | As per technical specifications uploaded |
| 8 | 5 KVA UPS IGBT Switching Technology, SMF, 26 Ah Battery | As per technical specifications uploaded |
| 9 | Computer Workstation Core Ultra 9 Processor, 128 GB RAM, 2 TB HDD, 1 TB SSD, 8 GB Graphic Card | As per technical specifications uploaded |
AI Tender Summary
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Tender Published
Tender notice published.
CompletedBid Submission Deadline
Online submission via eProcurement portal.
Upcoming · 8 daysBid Opening Date
Technical bids will be opened and evaluated.
Upcoming · 8 daysTender Documents
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