Defence Government Departments Closing in 6 days TDR #56364009

Tender For Preventive Maintenance For Wafer Surface Grinder

Issued by Government Departments · Delhi, Delhi
Tender Value
Ref. Documents
Estimated cost
Bid Submission
29 Jul 2026
6 days left
EMD
1.27 Lakhs
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Online

Tender Overview

Organization
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Tender ID
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Competition Type
NCB
Bidding Type
Tender
Location / State
Delhi → Delhi
EMD Exemption
Available
Quantity
Not Available
Website
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Contact Person
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Address
Click here to view address

Project Description

Tender for Preventive Maintenance For Wafer Surface Grinder

AI Tender Summary

OUR REF NO 56364009
AUTHORITY Government Departments
TENDER VALUE Ref. Documents
LAST DATE 29-07-2026
Authority
Authority Name Department Of Defence Research And Development
Work Description Tender for Preventive Maintenance For Wafer Surface Grinder
Basic Detail
Tender No SSPL/MMG/DPP/PBM/B/R/25-26/234
Bidding Type Tender
Location
City Delhi
State Delhi
Key Dates
Publish Date 08 Jul 2026
Submission Date 29 Jul 2026
Open Date 30 Jul 2026
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD 1.27 Lakhs
Exemption Available
Document List
b661a072-5da3-414c-8ebe-50a24b68453e.html
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Tender Timeline

Jul 08, 2026
11:30 IST

Tender Published

Tender notice published.

Completed
Jul 29, 2026
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Upcoming · 6 days
Jul 30, 2026

Bid Opening Date

Technical bids will be opened and evaluated.

Upcoming · 7 days

Tender Documents

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