Science and Technology Government Departments Closing in 10 days TDR #56329522

Bids Are invited for Spares For Daq For Overcurvature System

Issued by Government Departments · Thiruvananthapuram, Kerala
Tender Value
Ref. Documents
Estimated cost
Bid Submission
30 Jul 2026
10 days left
EMD
Ref. Documents
Bank guarantee accepted
Document Fee
Ref. Documents
Non-refundable
Tender Type
Gem

Tender Overview

Organization
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Tender ID
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Competition Type
NCB
Bidding Type
Tender
Location / State
Thiruvananthapuram → Kerala
EMD Exemption
Not Available
Quantity
7
Website
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Contact Person
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Address
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Project Description

Bids Are invited for Spares For Daq For Overcurvature System Data Acquisition System- Bridge Lifier Make- Hbk Model 1- Mx1615 - Data Acquisition System- Bridge Lifier Make- Hbk Model Number 1- Mx1615 , Interface Card -Can Bus With Modbus Gateway Module Make- Hbk Model 1- Mx471c - Interface Card -Can Bus With Modbus Gateway Module Make -Hbk Model 1- Mx471c , Interface- Communicator Can Ethernet Modbus Tcp-2 Port Make- Hbk Model Ab7319-B - Interface- Communicator Can Ethernet Modbus Tcp-2 Port Model Ab7319-B , Linear Strain Gauge Make- Hbk Model 1-Ly41- 6 By 350V3 - Strain Guage- Linear Strain Gauge Make - Hbk Model 1-Ly41- 6 By 350V3 Each Packet Contains 10 No. , Self-Adhesive Rtd Surface Mountable Temperature Compensation Sensor Make- Hbk Model 1-Tt-3 By 100 - Temperature Sensor- Self-Adhesive Rtd Surface Mountable Temperature Compensation Sensor Make- Hbk Model 1-Tt-3 By 100 Each Packet Contains 10 No. Total Quantity : 7

BOQ

Sl. No. Item TitleItem Description
1Data Acquisition System- Bridge Amplifier Make- HBK Model 1- MX1615Data Acquisition System- Bridge Amplifier Make- HBK Model number 1- MX1615
2INTERFACE CARD -CAN bus with Modbus gateway module Make- HBK Model 1- MX471CINTERFACE CARD -CAN bus with Modbus gateway module Make -HBK Model 1- MX471C
3INTERFACE- Communicator CAN Ethernet Modbus TCP-2 port Make- HBK Model AB7319-BINTERFACE- Communicator CAN Ethernet Modbus TCP-2 port Model AB7319-B
4LINEAR STRAIN GAUGE Make- HBK Model 1-LY41- 6 by 350V3STRAIN GUAGE- LINEAR STRAIN GAUGE Make - HBK Model 1-LY41- 6 by 350V3 each packet contains 10 No.
5Self-adhesive RTD Surface mountable temperature compensation sensor Make- HBK Model 1-TT-3 by 100TEMPERATURE SENSOR- Self-adhesive RTD Surface mountable temperature compensation sensor Make- HBK Model 1-TT-3 by 100 each packet contains 10 No.

AI Tender Summary

OUR REF NO 56329522
AUTHORITY Government Departments
TENDER VALUE Ref. Documents
LAST DATE 30-07-2026
Authority
Authority Name Department Of Space
Work Description Bids Are invited for Spares For Daq For Overcurvature System Data Acquisition System- Bridge Lifier Make- Hbk Model 1- Mx1615 - Data Acquisition System- Bridge Lifier Make- Hbk Model Number 1- Mx1615 , Interface Card -Can Bus With Modbus Gateway Module Make- Hbk Model 1- Mx471c - Interface Card -Can Bus With Modbus Gateway Module Make -Hbk Model 1- Mx471c , Interface- Communicator Can Ethernet Modbus Tcp-2 Port Make- Hbk Model Ab7319-B - Interface- Communicator Can Ethernet Modbus Tcp-2 Port Model Ab7319-B , Linear Strain Gauge Make- Hbk Model 1-Ly41- 6 By 350V3 - Strain Guage- Linear Strain Gauge Make - Hbk Model 1-Ly41- 6 By 350V3 Each Packet Contains 10 No. , Self-Adhesive Rtd Surface Mountable Temperature Compensation Sensor Make- Hbk Model 1-Tt-3 By 100 - Temperature Sensor- Self-Adhesive Rtd Surface Mountable Temperature Compensation Sensor Make- Hbk Model 1-Tt-3 By 100 Each Packet Contains 10 No. Total Quantity : 7
Basic Detail
Tender No GEM/2026/B/7723831
Bidding Type Tender
Location
City Thiruvananthapuram
State Kerala
Key Dates
Publish Date 07 Jul 2026
Submission Date 30 Jul 2026
Open Date 30 Jul 2026
Finance
Tender Value Ref. Documents
Tender Fee Ref. Documents
EMD Ref. Documents
Exemption Not Available
Document List
ee8ff3a9-c2fe-45f0-b6d9-eb887aa54013.pdf
1329specc_4467a613-da36-4741-99271783385281578_vsscgemp12.pdf
9535252_Boq_1.xlsx
annexure_specifications_2026-06-29-23-24-28_bff0de0f6b140ecc26691e444cf24952.pdf
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Tender Timeline

Jul 07, 2026
11:30 IST

Tender Published

Tender notice published.

Completed
Jul 30, 2026
17:00 IST

Bid Submission Deadline

Online submission via eProcurement portal.

Upcoming · 10 days
Jul 30, 2026

Bid Opening Date

Technical bids will be opened and evaluated.

Upcoming · 10 days

Tender Documents

Download All (ZIP) ↓
pdf

ee8ff3a9-c2fe-45f0-b6d9-eb887aa54013.pdf

pdf

1329specc_4467a613-da36-4741-99271783385281578_vsscgemp12.pdf

xlsx

9535252_Boq_1.xlsx

pdf

annexure_specifications_2026-06-29-23-24-28_bff0de0f6b140ecc26691e444cf24952.pdf

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